Flextac Wire Dots are a wire tacking system consisting of pre-cut shapes of a thin, flexible polymer film membrane coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive.

The result is a highly conformable, high strength bond. The adhesive release liner is an environmentally stable poly-coated kraft liner.

As with any wire tacking material, in order to achieve maximum bond strength and reliability, application surface must be clean, dry and free of flux, skin oils and other contaminants. Clean with isopropyl alcohol or equivalent if necessary.

Firm application pressure develops better adhesive contact and thus improves bond strength. Avoid placing Flextac Wire Dots or any other wire tacking material directly over exposed copper or plated surfaces.

Flextac Wire Dots will perform best when applied at temperatures between 60F (15C) and 100F (38C). Do not apply below 50F (10C).

Jumper wires bonded with messy and difficult to use quick set glue.


Jumper wires bonded with neat, easy to use, Wire Dots.

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General Performance Characteristics

- Bond Strength
Flextac Wire Dots have very good initial bond strength that generally increases as a function of time over approximately 72 hours to stabilize as a high strength reliable bond.

- Humidity Resistance
High humidity has a minimal effect on adhesive performance. Bond strengths are actually slightly higher after exposure for 7 days at 90F (32C) and 90% relative humidity.

- Temperature Cycling and Bond Strength
Bond strength generally increases after four times through:
4 hours at 158F (70C)
4 hours at -20F (-29C)
16 hours at room temperature.

- Cleaning Process Resistance (chemical & hot water)
Flextac Wire Dots will hold securely after exposure to numerous chemicals including most flux cleaning solutions/sprays, saponifiers, "Freon" TF, mild acids and alkalis. Wires will hold securely through a typical PCB hot water wash.

- Temperature Range
Low: -40F (-40C)
High short term: 390F (200C)
High long term: 275F (135C)

- Repositioning
Flextac Wire Dots can be repositioned during and immediately after initial bonding without causing adhesive transfer or loss of bond strength.

- Shelf Life
Product retains its performance and properties for one year from date of purchase if properly stored at room temperature conditions. Storage in plastic bag is recommended.

- Applications
Jumper Wires
Conductor Repair, Surface Wire Method

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310-0651 Wire Dots, 6.5mm Round
Bonding 30 gauge jumper wire.

310-0652 Wire Dots, 6.5mm Square
Bonding 30 gauge jumper wire.

310-1001 Wire Dots, 10.0 mm Round
Bonding (3) 30 gauge jumper wires.

310-1002 Wire Dots, 10.0 mm Square
Bonding (3) 30 gauge jumper wires.

Physical and Thermal Properties

Property

Typical Value

Unit

Test Method

Peel Strength 72 hrs @ 22C

84

0z./in.

ASTM D3330 Modified

Static Shear Strength 72F (22C) / 1000g

>10.000

min

ASTM D3654

Tensile Strength (Yield) 72F (22C)

>2.600

psi

ASTM D2370

Elongation

100

%

ASTM D2370

Thermal Conductivity

0,17

w/m-k

ASTM C518

Coefficient of Thermal Expansion

5,5 × 10^-4

m/m/C

ASTM D696 25-175C

Electrical Properties

Property

Typical Value

Unit

Test Method

Dielectric Strength

1700

volts/mil

ASTM D149

Dielectric Constant 25C, 1 kHz

3.4

-

ASTM D150

Dissipation Factor 25C, 1 kHz

0.018

-

ASTM D150

Surface Resistivity - Adhesive Layer

>1×10¹⁴

ohm/square

ASTM D257

Surface Resistivity - Polymer Film Layer

>1×10¹⁶

ohm/square

ASTM D257

Volume Resistivity - Adhesive Layer

>1×10¹⁵

ohm/cm

ASTM D257

Volume Resistivity - Polymer Film Layer

>1×10¹⁸

ohm/cm

ASTM D257

Insulation/Moisture Resistance - Adhesive Layer

>1×10¹¹

ohm

MIL-I-46058C (100VDC 60sec)

Insulation/Moisture Resistance - Polymer Film Layer

>1×10¹²

ohm

MIL-I-46058C (100VDC 60sec)

Voltage Breakdown

3500

volts

-