This kit includes the tools and materials needed to reliably replace damaged surface mount and BGA pads. The unique Circuit Frames are made from rolled, annealed copper electroplated with solder and finished with dry film adhesive backing. You simply select the appropriate size pad, trim it from the Circuit Frame and bond it to the circuit board surface. Included with the kit are a bonding iron and tips to match the various sizes of the surface mount and BGA pads.

A multifunctional epoxy is included for over coating the lap solder joint formed between the replacement pad and connecting circuitry. Step-by-step instructions for replacing surface mount and BGA pads are outlined in the manual included with each kit. This manual is an excellent tool for repair technicians and covers techniques that can be used in a variety of repair applications.

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Applications

- Surface Mount Pad Repair, Film Adhesive Method
- BGA Pad Repair, Film Adhesive Method

Features and Benefits

- Industry approved - meets IPC guidelines
- Complete - everything required to replace damaged surface mount and BGA pads
- Convenient packaging in ESD safe carry case
- Variety - hundreds of replacement pads plus custom shapes available.

Before After
Surface mount pads repaired with new dry film adhesive backed pads.

Products

Part No.

Description

201-1100

Micro Pad Repair Kit, 120 VAC

201-1102

Micro Pad Repair Kit, 230 VAC¹

201-1200

Micro Pad Repair Kit, Aerospace Application *

201-1104

Micro Pad Repair Consumable Kit, Aerospace Application

201-1106

Micro Pad Repair Consumable Kit

* The Micro Pad Repair Kit, Aerospace Application is designed to meet strict outgassing requirements. The kit is similar to the Micro Pad Repair Kit #201-1100, except the bonding iron is not included and the circuit frames do not have a dry film adhesive backing. The Circuit Frames have an unlimited shelf life.

Kit Includes

Part No.

Qty

Description

115-3102

1

Bonding Iron, 120 VAC

115-2104

1

Bonding Tip, Tapered

115-2205

1

Bonding Tip, .035" Diameter

115-2306

1

Bonding Tip, .040" × .060"

115-2320

1

Bonding Tip, .095" × .095"

CS025035AS

1

Circuit Frame, BGA Pads .025"/.035"

CSVAR1AS

2

Circuit Frame, SMP Variety

115-3302

4

Epoxy

235-2102

4

Foam Swab

355-2102

1

Knife

115-3314

4

Mixing Stick

115-3312

4

Plastic Cup

115-3360

4

Probe

950-4508

1

Tape, Kapton

115-3142

1

Tip Tool

335-5183

1

Tweezer

115-3103

1

¹Bonding Iron, 230 VAC (201-2102 Kit)