Repair technicians appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads. The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. The Rework Stand has a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. A digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle.

Applications

- Surface Mount Pad Repair, Film Adhesive Method
- BGA Pad Repair, Film Adhesive Method
- Land Repair, Film Adhesive Method
- Edge Contact Repair, Film Adhesive Method

Features and Benefits

- Precision design - permits bonding of minute patterns.
- Heavy duty construction - ensures platform stability.
- Built-in calibration slide maintains regulated bonding force.
- Temperature controller maintains uniform bonding temperature for better results.

Specifications

Frame Construction
Throat Depth
Throat Height
Vertical Travel
Weight
Power Input

11 gauge steel
12" (30.0 cm)
7" (17.0 cm)
7" (17.0 cm)
10 lb (4.5 kg)
85 to 265 VDC/VAC
50 to 400 Hz, 5VA max.

Temperature Controller

   Range
   Resolution
Cycle Time
Power Consumption
Heat Output
Heat Up Time

Ambient to 990F (871C)
1F (1C)
2 to 80 sec.
5 VA max.
20 Watts
10 minutes

Part No.

Description

115-3118

Circuit Bonding System w/Temperature Controller, 120 VAC

115-3119

Circuit Bonding System w/Fixed Temperature, 120 VAC

115-3218

Circuit Bonding System w/Temperature Controller, 230 VAC

115-3219

Circuit Bonding System w/Fixed Temperature, 230 VAC